80 A per circuit — bus-level power in a 4-position header
Press-fit termination — solderless backplane assembly
This eliminates thermal stress on the board and simplifies rework — a single pin can be replaced without desoldering the entire header. The through-hole mounting provides mechanical retention in the board, and the press-fit interface is rated for the full 80 A per circuit when mated with the corresponding Impact receptacle.
30.0 µin gold — high-cycle mating duty
The 4-position, 80 A, press-fit power header is a specific footprint; confirm the mating Impact receptacle and the board hole pattern before committing the BOM line.