Compression Contact for Board-to-Board Stacking
The 2199075-2 is a non-gendered compression contact from TE Connectivity's spring-loaded contacts line, designed for board-to-board interconnect where a low-profile, solderless connection is needed. With 4 positions arranged in 2 rows at 0.063" (1.60mm) pitch and a row spacing of 0.134" (3.40mm), it provides a compact footprint for parallel PCB stacking. The surface-mount termination allows automated pick-and-place assembly, supporting high-volume production.
SMT Termination and Board Layout Fit
The 0.063" (1.60mm) pitch sets the PCB land pattern; the dual-row arrangement with 0.134" (3.40mm) row spacing defines the overall footprint. As a compression contact, it mates with a matching spring-loaded contact or pad on the opposing board without a separate housing, reducing z-height and component count. The bulk package means parts are supplied loose in a bag or tube, not on tape-and-reel. For high-volume lines, this may require manual handling or a tube feeder.