1x4 Ganged QSFP+ Cage Assembly with Press-Fit Pins
The TE Connectivity 2214574-2 is a QSFP+ receptacle with an integrated ganged cage that holds four ports side-by-side in a single 1x4 body. The 152 positions break down as the standard 38 per QSFP+ port, so the PCB footprint mirrors four individual QSFP+ connectors but the cage and shield are one piece. Press-fit termination means the compliant pins get pressed into plated through-holes — no solder wicking into the cage, no wave solder shadow behind the body. The cage carries built-in EMI shielding and an integrated light pipe. That saves the cost of a separate shield clip and a discrete light pipe component, but the light pipe exit position on the bezel side of the cage is fixed — the panel cutout and the PCB mounting hole pattern must align with it. The assembly ships in a tray, which is the standard packaging for a part this size; the cage is rigid enough that tray handling does not bend the press-fit pins.
Press-Fit Assembly vs. Solder Reflow
The 2214574-2 uses press-fit termination, not solder. That changes the board assembly flow: the PCB gets drilled with the correct finished hole size for the compliant pin (typically a 0.40 mm drill for a 0.35 mm finished hole in standard QSFP+ footprints), and the cage gets pressed in with a pneumatic or arbor press. No reflow profile to qualify, no solder voids under the cage, and the connector can be removed and replaced without desoldering if a pin gets bent. The trade-off is that the press tooling and the hole size tolerance are tighter than a soldered through-hole part — a 0.05 mm oversize hole drops the retention force below the specified minimum. Against a soldered QSFP+ cage, the press-fit version also avoids the risk of solder wicking up the shield fingers, which can stiffen the grounding spring and degrade EMI performance. The 2214574-2's integrated cage and shield mean the ground path from the cage to the PCB runs through the press-fit pins and the board ground vias — the same path a soldered cage uses, but without the solder fillet.
Mating and Module Compatibility
The 2214574-2 is a QSFP+ receptacle, which means it accepts standard QSFP+ modules (28 Gbps per lane, 4 lanes) and is mechanically compatible with QSFP28 modules (25 Gbps per lane, 4 lanes) — the physical interface and pinout are identical. The 38-position per-port layout follows the SFF-8436 specification for QSFP+, so any module that complies with that standard will insert and latch. The integrated cage provides the spring-finger EMI gasket around each port opening, and the light pipe guides the module's status LED to the panel face.