ZQSFP+ Cage with Integrated Heat Sink — Press-Fit for Backplane Duty
This is the port-side interface for high-speed QSFP+ and QSFP28 transceivers, providing the mechanical retention, EMI containment, and thermal management those modules require. This is the typical layout for line-card faceplates and switch-port arrays where the cage sits behind the panel cutout. The EMI shielding feature — a spring-finger gasket or contact array at the cage mouth — bonds the cage to the chassis ground, keeping radiated emissions from the high-speed SerDes lines inside the enclosure.
Press-Fit Termination — Why It Matters for This Assembly
Press-fit termination means the 2227103-1 is specified for a solderless backplane process. The compliant pin geometry — typically an eye-of-the-needle design — deforms elastically as it enters the plated through-hole, creating a gas-tight interference fit. This avoids the thermal shock of wave or reflow soldering and allows the cage to be pressed into a fully populated board without damaging adjacent components. It also makes field replacement feasible: the cage can be pressed out and a new one installed, provided the board is designed for it. The trade-off is that the PCB hole diameter and plating thickness must match the pin design within a tighter tolerance than a solder tail would require.