1x4 Ganged zSFP+ Cage — Press-Fit for Backplane I/O
The TE Connectivity 2227729-1 is a zSFP+ cage in a ganged 1x4 configuration, designed for high-density I/O on line cards and switch fabrics. The through-hole right-angle mount orients the cage parallel to the board edge, so the four SFP+ modules insert from the faceplate side, keeping the signal path short to the ASIC. EMI shielding is built into the cage — each port is isolated from its neighbours to prevent crosstalk between adjacent transceivers. The integrated light pipe routes the module's link/activity LED to the faceplate, eliminating a separate light-pipe assembly on the board.
Press-Fit Assembly — No Solder, No Thermal Stress
Press-fit is the termination method for high-reliability backplane connectors because it avoids the thermal shock of wave or reflow soldering. The compliant pin compresses as it enters the plated through-hole, creating a gas-tight joint that meets the same reliability as solder but allows the cage to be removed and replaced if a port fails in the field. The right-angle orientation means the cage body sits perpendicular to the PCB, so the four module slots are accessible from the card edge — standard for 1U and 2U switch chassis where faceplate real estate is tight.
No official pin-compatible substitute exists; if the design requires a different port count or orientation, the zSFP+ family includes 1x2 and 1x6 ganged variants, but the 1x4 footprint is specific to this order code.