2.00 mm Pitch Board-to-Board Receptacle for Dense SMT Layouts
Its 2.00 mm pitch allows tighter routing than the legacy 2.54 mm spacing, freeing PCB real estate for additional traces or smaller board dimensions. Tape-and-reel packaging ensures compatibility with automated pick-and-place lines, reducing handling costs in volume assembly.
Why the Gold Plating Matters for Your Build
At this thickness, the contact resists fretting corrosion and maintains stable contact resistance well beyond the 50-cycle typical of tin flash. For a board-to-board connection that stays mated for the product life, this margin translates to long-term reliability under vibration or thermal cycling. The UL94 V-0 rated LCP housing withstands reflow temperatures without warping, supporting lead-free soldering profiles.
How It Compares to AMPMODU Peers
Compared to the 1376775-3 (3-position, 3 A, 250 VAC, 8.00 µinch gold mating finish), the 2307727-2 offers a lower current rating (2 A vs 3 A) but thicker gold (30.0 µinch vs 8.00 µinch), which extends mating cycle life. The 1376775-3 is box-packaged, not tape-and-reel, so it is less suited for automated SMT lines.