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TE Connectivity AMP Connectors 2307727-3 — Female Socket Headers

2307727-3 TE Connectivity AMPMODU 3-Pin 2mm Board-to-Board

MPN2307727-3
Active

TE Connectivity AMPMODU board-to-board receptacle, 3 positions, 2.00 mm pitch, single row, surface mount right angle, 30.0 µin gold mating finish, rated 2 A at 125 V, UL94 V-0 LCP housing.

$0.9900Ref. price · indicative, final on quote
RoHSROHS3 Compliant
SeriesAMPMODU
Source DocumentedChannel stated on listing & quote
Condition PhotosReal unit photos / video on request
WhatsApp AnswersFast human replies for stock & sourcing questions
Worldwide DispatchDHL/FedEx — transit quoted per order
Independent supplier — new & surplus connector stock· Listing updated Aug 2026

Specifications

2307727-3 key specifications
ParameterValue
SeriesAMPMODU
TypeFemale Socket
MountingSurface Mount, Right Angle
Connector typeReceptacle
Fastening typePush-Pull
Voltage rating125V
Current rating2A
Operating temperature-40°C~125°C
Contact materialPhosphor Bronze
Insulation colorBlack
Insulation height0.080\" (2.03mm)
Insulation materialLiquid Crystal Polymer (LCP)

All specifications

2307727-3 additional specifications
ParameterValue
Material flammability ratingUL94 V-0
StyleBoard to Board
PackageTape & Reel (TR); Cut Tape (CT)
TerminationSolder
Contact shapeSquare
Rows1
Pitch0.079\" (2.00mm)
Positions3
Contact finish - postTin
Contact finish - matingGold
Contact finish thickness - post118.1µin (3.00µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

Gold Mating Finish and Contact Reliability

The 2307727-3: The post finish is tin, which is standard for solder joint compatibility. Operating temperature spans -40°C to 125°C, covering most industrial and automotive interior environments.

No stock-holding claim — quoted to order per RFQ.

Frequently asked questions

What is the pinout of the 2307727-3?

All positions are loaded. The pinout is a simple 1-to-1 pass-through: position 1 to position 3 in a single row, matching the mating header's pin sequence. No keying or polarization beyond the standard AMPMODU interface.