Board Layout Fit: 2.00mm Pitch, SMT Footprint
The 2307812-5: The 2.00mm pitch sets the board footprint for this single-row, 5-position receptacle — the same pitch as the mating header, so the pad layout is a straight 8.00mm row of five pads. The 0.177" (4.50mm) insulation height leaves clearance under the body for trace routing on inner layers. Surface-mount termination with pick-and-place feature means it feeds directly into a reflow line — no through-hole soldering step, no secondary operation. The LCP housing handles reflow temperatures without warping.
Current and Contact: 2A with Tin Plating
Rated 2A per contact at 125V, with tin-on-tin mating finish at 118.1µin (3.00µm) thickness.
ROHS3 compliant. No official successor or pin-compatible alternate within the AMPMODU series; the 2307812 base number covers multiple position counts, but the 5-position variant is the only one with this exact pitch and SMT orientation.