260-Position DDR4 SODIMM with Reverse-Angle Mount
Gold flash contact finish provides reliable electrical contact for the rated mating cycles typical of SODIMM applications, while the integrated board guide and latches ensure the memory module aligns and locks without stressing the solder joints.
Reverse-Angle Orientation and Board Fit
The reverse mounting feature combined with the 25° angle means the connector body is soldered on the top side of the PCB but the module inserts from the bottom—common in blade servers and thin laptops where the memory sits on the back of the board. This is not a standard straight or right-angle SODIMM; the 25° tilt reduces the z-height of the module above the board compared to a vertical socket. Compared to a standard 260-position DDR4 SODIMM connector (straight or right-angle), the reverse-angle variant requires a different PCB footprint and mechanical clearance—confirm the board layout supports the reverse insertion before committing the BOM.