DDR4 SODIMM socket for compact memory modules
The 2309408-2 is a DDR4 SODIMM connector from TE Connectivity's AdvancedMC series, designed for 260-position memory modules with a 4.00 mm mated height.
Reverse mount and 25° angle for tight board stacks
Compared to the normal-mount sibling 2309409-2 (5.20 mm height), this reverse-mount version at 4.00 mm height saves 1.20 mm of z-axis clearance, critical for thin-profile enclosures. The 5.00µin gold plating on contacts supports reliable mating over repeated insertion cycles, versus the flash plating on 2309410-1 which is suited for lower-cycle applications.
Board guide and latches for secure module retention
Integrated board guide aids alignment during module insertion, while the latches provide mechanical retention against shock and vibration in mobile or embedded systems. The 0.047" (1.20 mm) card thickness is standard for DDR4 SODIMM modules.