260-position DDR4 SODIMM socket with board guide and latches
The 2309409-1 is a 260-position DDR4 SODIMM connector from TE Connectivity's AdvancedMC series, designed for surface-mount soldering onto a motherboard or mezzanine card. The 0.205" (5.20mm) mated height keeps the memory module low-profile, while the 25° angled insertion allows the module to seat at an angle before being pressed flat — a standard SODIMM mating sequence that avoids bending the contacts. Board guide and latches are built into the housing, so the module aligns during insertion and locks in place without a separate retention clip. The latches release by pressing outward, which matters when the socket is near other components. The connector accepts standard DDR4 SO-DIMM modules with a card thickness of 0.047" (1.20mm). Gold flash contact finish is used.
Peer comparison: 2309410-3 reverse-mount variant
The closest sibling is the 2309410-3, which shares the same 260 positions, 0.205" (5.20mm) height, and 25° insertion angle, but uses a reverse mounting orientation — the contacts are on the opposite side of the board. The 2309410-3 also has thicker gold plating (10.0µin / 0.25µm) compared to the flash plating on the 2309409-1, which may matter for applications requiring more mating cycles.