Board-to-Board Interconnect for Tight Pitch Routing
For high-cycle field-service applications, a heavier gold grade would be preferred; here the tin-plated post (12.0 µinch) handles the solder joint side.
In vibration-prone assemblies, a secondary mechanical retention method (board standoffs or adhesive) is advisable. The Pick and Place feature indicates the part is supplied in tube packaging but with a flat top surface suitable for vacuum pick-and-place during automated assembly.
No official cross-reference or pin-compatible alternative is listed in the AMPMODU series for this exact 4-position dual-row configuration — the BOM position count and pitch must match the mating header.
Temperature Range and Application Fit
The LCP housing maintains dimensional stability across the range, and the phosphor bronze contacts resist stress relaxation at the high end. Voltage rating is 125 V, which suits low-voltage signal and control circuits.