Board-to-Board Signal Interconnect for Tight Pitch
The 2314868-5: The 2 A per-contact rating and 125 V voltage ceiling suit it for low-current signal paths, not power distribution.
The single-row layout keeps the z-height low: the insulator stands 4.50 mm off the board, and the solder tails extend another 2.00 mm below. This is a standard AMPMODU footprint; the mating header must also be 2.00 mm pitch, single-row, 5 positions.
Housing Material and Temperature Range
The insulator is molded from liquid crystal polymer (LCP) rated UL94 V-0, which holds its dimensional stability through reflow soldering and high-temperature environments.
It is RoHS3 compliant.
The 2314868-5 uses a thinner gold flash (3.94 µin) and a 2 A rating, making the 1376775-2 a better choice for applications requiring higher current or more mating cycles.