2.00 mm Pitch, 3-Position Board-to-Board Receptacle
The 2314878-3: This is a 3-position, single-row female socket header from the AMPMODU series, designed for board-to-board stacking. The solder tails are tin-plated 3.00 µm thick, compatible with standard through-hole soldering.
Current Rating and Contact Plating
Rated 2 A per contact. The gold-on-phosphor-bronze contact delivers consistent resistance over repeated mates — the 30 µinch gold layer handles hundreds of cycles without exposing the base metal.
The 2.00 mm pitch leaves 0.079" between adjacent pads — a standard 2-layer board routes easily between them.