Contact Plating and Mating Life
The 2314928-6: Gold on the mating face at 3.94 µinch (0.100 µm) — a flash grade that protects against oxidation during initial mating and moderate storage, but not rated for high-cycle field-service reconnects. For repeated mating, a thicker gold finish (e.g., 8.00 µinch on peer 1376775-2) would extend contact life. The post is tin-plated at 118.1 µinch (3.00 µm), which provides a reliable solder joint and corrosion resistance on the tail side.
Peer Comparison: 1376775-2 vs 2314928-6
The closest functional alternative is the 1376775-2 (5-position, 2.54 mm pitch, 3 A, 250 VAC, thicker 8.00 µinch gold). The 2.00 mm pitch of 2314928-6 is denser, but the 1376775-2 carries higher current and voltage ratings — swap only if the board layout and signal levels allow the wider pitch.