SFP+ Cage with Press-Fit Termination and Board Lock
The TE Connectivity 2317434-1 is an SFP+ cage, the shielded enclosure that receives an SFP+ transceiver module and grounds it to the host board. It uses press-fit termination — the compliant pins are pressed into plated through-holes, eliminating the solder wave and the thermal stress that comes with it. Board locks on the mounting posts anchor the cage during reflow and resist the insertion/withdrawal forces of repeated module swaps. The integrated EMI shielding, formed by the cage walls and ground fingers, contains radiated emissions from the high-speed serial link.
Press-Fit Assembly and Board Retention
Press-fit termination suits backplane or mid-board applications where a solderless assembly is preferred — the compliant pin interface is rework-friendly and avoids the thermal cycle of wave soldering. The board locks provide mechanical retention against the shear force from cable strain or module insertion, and they keep the cage seated during the press-fit process.
SFP+ Compatibility and Signal Integrity
This cage is designed to the SFP+ Multi-Source Agreement (MSA) form factor, so it accepts standard SFP+ transceiver modules from any vendor that follows the MSA mechanical outline. The EMI shielding is integral to the cage design — the stamped metal shell with ground fingers contacts the module's own shield, creating a continuous Faraday cage around the high-speed differential pairs. For signal integrity, the press-fit pin field preserves the controlled impedance trace routing from the ASIC to the cage, provided the PCB layout follows the manufacturer's recommended footprint and ground-plane cutouts.