8-position, 5.00 mm pitch, right-angle SMT header
The 2318770-8 is an 8-position, single-level header from the TE WireMate and Buchanan series.
Board-fit and termination details
Surface-mount termination with solder tails — the header is designed for reflow assembly. Insulation height is 0.252 inches (6.40 mm) above the board — this is the clearance the mated wire housing will occupy above the PCB surface.
