257-position LGA socket for processor and ASIC landing
The 2319757-1 is a DMD series LGA socket from TE Connectivity AMP Connectors, designed to land a 257-pin device on a 20x30 grid at 1.00mm pitch. It uses a surface-mount solder termination and an open-frame thermoplastic housing rated UL94 V-0, with an integrated board guide to assist alignment during reflow. The gold mating finish at 3.00µin thickness supports moderate mating cycles typical of production-level device insertion, not repeated field service.
1.00mm pitch and 257-position grid define the footprint
The 0.039" (1.00mm) mating pitch matches standard LGA land patterns for high-density processor or ASIC packages, requiring a corresponding PCB footprint with tight routing clearance. The 257-position grid (20x30) is a specific device footprint — confirm your BGA/LGA ball map matches before committing the BOM line. Operating temperature spans -25°C to 100°C, covering most indoor commercial and industrial equipment but not extended automotive or outdoor enclosure extremes.
ROHS3 compliant.