The 2355177-5: The 2.00 mm (0.079 inch) pitch on this single-row header sets the board footprint for a 5-position interconnect — each pin centerline is 2.00 mm from the next, which is tighter than the legacy 0.100-inch (2.54 mm) standard. That means narrower trace escapes between pads and a smaller via keep-out zone on the inner layers.
Mating Contact Finish and Cycle Life
The mating surface carries 15.0 µinch (0.38 µm) gold over nickel — that is the standard thickness for reliable signal-level connections through 200+ mating cycles in factory-floor or test-equipment environments. Tin contacts at the same thickness would fret and oxidize after repeated mate/unmate cycles.
ROHS3 compliant per the manufacturer listing.