The 2355184-4: For a 4-position single-row header, the overall footprint is just 6.00 mm wide across the pins, leaving room for trace escape on a single layer. Unshrouded design means the male pins are exposed after soldering; the mating receptacle must align directly over the pins.
Contact Interface: Gold Plating and Current Capability
The 2 A ceiling is typical for signal-level interconnects at this pitch; the housing material (UL94 V-0 thermoplastic) limits the temperature rise under load. The copper alloy contact material handles thermal cycling without stress relaxation.
The tube package supports pick-and-place assembly with the listed feature.