TE Connectivity AMP Connectors 2367196-4, High Performance Interconnect (HPI) series, 1.00mm pitch, 4-position single-row shrouded header, male pin, surface mount right-angle, tin-plated contacts, 2A/50V, locking ramp, tape & reel.
| Parameter | Value |
|---|---|
| Series | High Performance Interconnect (HPI) |
| Type | Male Pin |
| Mounting | Surface Mount, Right Angle |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 50V |
| Current rating | 2A |
| Operating temperature | -40°C~85°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.114\" (2.90mm) |
| Insulation material | Thermoplastic, Halogen Free |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Features | Pick and Place, Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Contact shape | Rectangular |
| Rows | 1 |
| Pitch | 0.039\" (1.00mm) |
| Positions | 4 |
| Contact finish - post | Tin |
| Contact finish - mating | Tin |
| Contact length - mating | 0.087\" (2.21mm) |
| Contact finish thickness - post | 50.0µin (1.27µm) |
| Contact finish thickness - mating | 5.00µin (0.127µm) |
The 2367196-4: Mating and post contacts are tin-plated: 5.00 µin on the mating face, 50.0 µin on the solder tail. Tin is cost-effective for low-cycle applications (under 50 matings) in non-corrosive indoor environments. The 2 A rating per contact suits signal-level loads — think sensor inputs, LED drivers, or low-power data lines.
The pick-and-place feature and solder retention pads simplify automated placement and reflow.
This is a wire-to-board header. It mates with a 4-position, 1.00mm pitch receptacle housing from the same HPI series. Confirm the receptacle's circuit count and pitch match before ordering.
RoHS compliance is standard for TE's HPI series. The halogen-free thermoplastic housing and tin plating align with current regulatory requirements.