TE Connectivity AMP High Performance Interconnect (HPI) series header, 2367197-3, 1.00mm pitch, 3 positions, shrouded 4-wall, male pin, SMT, locking ramp, solder retention, 1A per contact, 50V, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | High Performance Interconnect (HPI) |
| Type | Male Pin |
| Mounting | Surface Mount |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 50V |
| Current rating | 1A per Contact |
| Operating temperature | -40°C~105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.169\" (4.30mm) |
| Insulation material | Plastic, Halogen Free |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tape & Reel (TR); Cut Tape (CT) |
| Features | Solder Retention |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Contact shape | Rectangular |
| Rows | 1 |
| Pitch | 0.039\" (1.00mm) |
| Positions | 3 |
| Contact finish - post | Tin |
| Contact finish - mating | Tin |
| Contact finish thickness - post | 50.0µin (1.27µm) |
| Contact finish thickness - mating | 5.00µin (0.127µm) |
The 2367197-3: Three positions, all loaded, in a single row — this is a compact wire-to-board interconnect for low-pin-count signal runs.
Surface-mount termination with built-in solder retention features — the header holds position during reflow, reducing tombstoning and improving first-pass yield on the assembly line.
2367197-3 is a shrouded male header from the TE HPI series. The mating half is a female receptacle housing from the same HPI series, accepting crimp terminals for 1.00mm pitch wire-to-board connections. Confirm the housing part number and terminal part number from the HPI series documentation for a complete three-piece interconnect.
Yes, the header includes solder retention features to hold it in place during SMT reflow, improving assembly yield.