The 2373376-8: The gold mating finish (3.94 µinch) on the copper alloy contacts provides reliable low-resistance connections over repeated mating cycles, while the tin-plated solder tails (78.7 µinch) ensure good solder wetting during reflow.
Surface Mount Termination for Automated Assembly
ROHS3 compliant, the header is suitable for lead-free soldering processes and meets the environmental requirements for electronics sold into global markets.
Comparing 2373376-8 with Peer Alternatives
If your board assembly is wave-solder only, the through-hole version avoids a reflow step; for SMT lines, the 2373376-8 is the correct fit. Another sibling, 1-2373378-2, is a 12-position version in the same surface-mount format with a thicker 30.0 µinch gold mating finish — choose it when the circuit count is higher or the application demands more mating cycles.