1.25 mm Pitch, 8-Position, Shrouded Header for Compact Wire-to-Board
The 2390138-8: This is a single-row, 8-position header from TE's High Performance Interconnect (HPI) series, built for board-to-cable/wire connections.
Tin Contacts at 1 A – Signal-Duty, Limited Cycle Life
SMT Termination with Solder Retention for Reflow Assembly
Surface-mount termination with a solder retention feature built into the housing. During reflow, the solder pads on the PCB hold the header in place while the paste wets the tails – the retention geometry keeps the part from floating or tilting as the solder solidifies. The insulation material is Liquid Crystal Polymer (LCP), rated UL94 V-0, which handles reflow temperatures without distortion.
It is ROHS3 compliant.
