Three-position header for power distribution
The 282828-3 is a 3-position, single-level, shrouded header from TE Connectivity's Buchanan series.
Pitch, current, and voltage ceiling
0.400" (10.16mm) pitch sets the board footprint — each pin centre is 10.16 mm from the next, which gives generous clearance for high-voltage routing on the PCB. Tin-plated copper alloy contacts are rated for the current density at 15 A, though tin limits the mating cycle count compared to gold — expect several hundred cycles before contact resistance drift becomes a concern in a clean environment.