Board fit and footprint decisions
The 2842140-3: This 6-position, dual-row breakaway header on 2.00 mm pitch is a compact board-to-board interconnect — the 0.079" row spacing matches the pitch, so the footprint is a 2×3 grid of 0.030" square pins. The tin post finish is standard for soldering; the 78.7 µinch thickness provides adequate wetting and shelf life.
Current and voltage envelope
The 2 A ceiling is typical for 2.00 mm pitch headers with gold contacts — the limiting factor is the contact cross-section and housing temperature rise, not the plating. At 125 V, the 2.00 mm pitch provides adequate creepage for most digital and analog signal circuits inside an enclosure.
As an unshrouded breakaway header, it mates with any AMPMODU 2.00 mm pitch receptacle that accepts a 0.025" square pin — typically the AMPMODU II or Micro-MaTch series receptacles with 6 positions in a 2×3 layout. Confirm the mating receptacle's pin cavity spacing matches 2.00 mm row-to-row before committing the BOM.