8-Position, 2.00 mm Pitch Board-to-Board Header
The 2842142-4: The gold-plated mating surface (3.94 µinch) provides reliable contact over repeated mating cycles, while the tin-plated solder tails (78.7 µinch) are compatible with standard SMT reflow profiles.
The pick-and-place feature means the header includes a flat top surface for vacuum nozzle pickup, reducing handling time during high-volume board assembly.
Compared to the shrouded, right-angle 1-1871673-2 (4 positions, 2.50 mm pitch, tin mating finish, through-hole), the 2842142-4 offers twice the circuit count (8 vs 4) at a tighter 2.00 mm pitch, with gold mating finish for better cycle life, but lacks the board-lock and shrouding for vibration-heavy environments. Against the through-hole 1376779-2 (3 A, 250 VAC, gold mating at 8.00 µinch), the 2842142-4 has a lower current rating (2 A) and voltage (125 VAC/DC), but offers SMT termination and a wider temperature range (-40°C to 125°C vs unspecified), suiting it for automated assembly and broader thermal environments.