Board-to-Board Fit: 2.00 mm Pitch, 10 Positions, Right-Angle
The 2842154-5: Rated 2 A per contact with gold on the mating face — the gold flash (3.94 µin / 0.100 µm) provides a low-resistance interface for repeated mating cycles typical in board-to-board applications where the header stays soldered and the receptacle is swapped during test or field service. The insulation height is just 0.059" (1.50 mm), keeping the profile low.
No minimum order quantity is assumed; the part is quoted against the BOM quantity you submit.
Mating and Termination: Push-Pull, Solder Tail
In a low-vibration environment this is sufficient; in high-shock applications a secondary retention method (e.g., a wire-to-board housing with a lock) should be considered. The square pin shape (0.64 mm nominal) fits standard 0.025" square-post receptacles common in the AMPMODU family.