Board-to-Board Stacking with 2.00 mm Pitch
Its 2.00 mm pitch and 2.00 mm row spacing set a compact footprint for parallel or mezzanine stacking, while the unshrouded profile keeps the z-height low — the insulation height is just 0.059" (1.50 mm).
The 0.110" (2.79 mm) solder tail length provides enough standoff for wave-solder fillet formation on standard 1.6 mm boards.
