The 292171-3: At 3 positions, this is a low-count signal or low-power interconnect, not a dense bus.
Surface-Mount Termination and Reflow Considerations
This is a surface-mount header — the SMD tails are soldered to the PCB during reflow. The housing is glass-filled PA6T (UL94 V-0), which withstands lead-free reflow temperatures without distortion.
It is ROHS3 compliant.
How This Header Compares to a Through-Hole Right-Angle Sibling
The closest peer in the CT series is the 1-292164-1 — an 11-position, through-hole right-angle header with a shrouded-4 wall and kinked solder pins. The 292171-3 is SMD, straight, 3 positions, and has a 3-wall shroud. The mounting difference (SMD vs through-hole) changes the assembly process and the board-side mechanical retention — the through-hole sibling has stronger pull-off force from the kinked pins, while the SMD version relies on the solder fillet and the board guide for alignment.