Board-to-Wire Header for Tight Enclosures
Where the Current Rating Lands
In practice, with 20 AWG wire and the matching Micro MATE-N-LOK crimp terminal, expect around 5 A per circuit at a 30°C rise; derate for higher ambient or bundled wires.

TE Connectivity AMP Connectors Micro MATE-N-LOK header, 12 circuits, single row, 3.00 mm pitch, shrouded 4-wall, right-angle through-hole solder, tin-plated male pins, board lock, locking ramp, UL94 V-0, -40°C to 105°C.
| Parameter | Value |
|---|---|
| Series | Micro MATE-N-LOK |
| Type | Male Pin |
| Mounting | Through Hole, Right Angle |
| Connector type | Header |
| Fastening type | Locking Ramp |
| Voltage rating | 250V |
| Current rating | Varies by Wire Gauge |
| Operating temperature | -40°C~105°C |
| Contact material | Brass |
| Insulation color | Black |
| Insulation height | 0.152\" (3.85mm) |
| Insulation material | Polyamide (PA), Nylon |
| Parameter | Value |
|---|---|
| Material flammability rating | UL94 V-0 |
| Style | Board to Cable/Wire |
| Package | Tray |
| Features | Board Lock |
| Shrouding | Shrouded - 4 Wall |
| Termination | Solder |
| Applications | General Purpose |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.118\" (3.00mm) |
| Positions | 12 |
| Contact finish - post | Tin |
| Contact length - post | 0.138\" (3.50mm) |
| Contact finish - mating | Tin |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
In practice, with 20 AWG wire and the matching Micro MATE-N-LOK crimp terminal, expect around 5 A per circuit at a 30°C rise; derate for higher ambient or bundled wires.
The mating half uses the same 3.00 mm pitch and locking ramp interface. Confirm the circuit count and keying position on the receptacle side before ordering.
The base product number is 1445055. TE Connectivity publishes a product drawing and application specification under that base number. The spec table on this page lists the verified ratings from that documentation.