TE Connectivity AMPMODU series, 3-1470209-3, board-to-board receptacle, 20 positions, 0.079" (2.00 mm) pitch, dual row, gold mating contacts, through-hole solder termination, black PA66 housing, UL94 V-0.
| Parameter | Value |
|---|---|
| Series | AMPMODU |
| Type | Female Socket |
| Mounting | Through Hole |
| Connector type | Receptacle |
| Fastening type | Push-Pull |
| Voltage rating | 250VAC |
| Operating temperature | -40°C ~ 105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.177\" (4.50mm) |
| Insulation material | Polyamide (PA66), Nylon 6/6 |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board |
| Package | Tray |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.079\" (2.00mm) |
| Positions | 20 |
| Row spacing - mating | 0.079\" (2.00mm) |
| Contact finish - post | Tin |
| Contact length - post | 0.102\" (2.60mm) |
| Contact finish - mating | Gold |
| Contact finish thickness - post | 80.0µin (2.03µm) |
| Contact finish thickness - mating | 8.00µin (0.203µm) |
The 3-1470209-3 is a 20-position, dual-row female socket header from the TE AMPMODU series, designed for board-to-board stacking at a 0.079" (2.00 mm) mating pitch.
Through-hole solder tails (0.102" / 2.60 mm post length) with tin finish (80.0 µin thickness) provide a reliable solder joint into the plated through-hole. The black PA66 housing carries a UL94 V-0 flammability rating and operates from -40°C to 105°C.
The mating pitch is 0.079" (2.00 mm) with an identical 0.079" row spacing, dual-row layout.
Yes, it is ROHS3 compliant.