The TE Connectivity AMPMODU 3-179437-0 is a 30-position, dual-row receptacle with outer shroud contacts, designed for board-to-board stacking or mezzanine interconnects. The 0.079" (2.00mm) pitch keeps the footprint compact — 30 circuits in two rows means 15 per row, a common count for parallel signal buses or I/O ribbon replacement. Tin contact finish is standard for cost-sensitive builds with limited mating cycles — think internal module connections rather than frequent field-service disconnects.
The outer shroud contacts wrap around the header's pins, providing mechanical stability and polarization. No crimp or through-hole option here — the board footprint must match the SMT pad layout for the 30 positions.
ROHS3 compliant, so it clears European and most global assembly lines without exemption paperwork. Tin plating meets the standard for consumer and industrial environments; no gold flash for high-cycle or corrosive-duty applications.