It uses a 0.031" (0.80 mm) pitch dual-row layout with center strip contacts, all gold-plated at 8.00 µin. The surface-mount termination and board guide feature suit it for automated SMT assembly in dense signal interconnects — think server backplanes, telecom line cards, or any mid-board stack where routing density matters more than per-contact current.
Stack Height Flexibility — One Plug, Four Gaps
That means the same BOM line covers multiple board-spacing requirements in a design family — the receptacle height variant, not the plug, sets the gap. For a procurement team, that simplifies inventory to one plug PN across builds with different z-height budgets.
How It Feeds the SMT Line
The board guide helps center the part during placement on a 0.80 mm pitch footprint.
Active Lifecycle — No LTB Pressure
There is no last-time-buy notice or end-of-life horizon on record, so it can be specified into new designs and multi-year production runs without obsolescence risk.