Free Height (FH) 120-Position Mezzanine Plug
That range covers common mezzanine gaps for processor boards, memory modules, and FPGA carrier cards. The ROHS3 compliance covers EU regulatory requirements for lead-free assembly.
Stacking Height Options vs. the 1-120532-2 Sibling
The 3-5177986-5 (0.80mm pitch, 120 positions) and the 1-120532-2 (1.00mm pitch, 84 positions) serve different density tiers within TE's mezzanine portfolio. The 0.80mm pitch of the 3-5177986-5 packs 60 contacts per row, compared to 42 per row on the 1.00mm-pitch sibling — a 43% increase in linear contact density. The 3-5177986-5 also supports taller stack heights (20mm max vs. 6.35mm on the 1-120532-2), making it the choice for wider board spacing. The 1-120532-2 carries a thicker gold finish (50.0µin vs. 8.00µin) and a pick-and-place feature, but its 84 positions and 1.00mm pitch limit its use to lower-density, higher-durability applications.
