Board-Stacking Interconnect for Tight Pitch Mezzanine Designs
It uses a 0.80 mm pitch and a dual-row, center-strip contact arrangement, which keeps the footprint compact while routing a high number of signal lines between parallel PCBs. The connector is surface-mount, with a built-in board guide that helps align the plug during assembly and takes shear loads off the solder joints once mated. The gold-plated contacts (8.00 µin) are suited for signal-level currents in controlled environments — think server blades, network switches, or telecom line cards where the connector stays mated and the environment is clean. The 0.80 mm pitch means the PCB escape routing needs careful planning; a typical via-in-pad or microvia stack-up is common for this density.
Stack Height Flexibility Without Changing the Footprint
This plug supports mated stacking heights of 8 mm, 12 mm, 16 mm, and 20 mm, depending on which mating receptacle you pair it with. That means the same PCB footprint can serve different board spacings across a product family, which simplifies the BOM and layout reuse. The 0.309" (7.85 mm) height above board of the plug itself gives a baseline for the z-height budget.