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TE Connectivity AMP Connectors 3-794638-4 — Pin Headers

3-794638-4 TE Connectivity Micro MATE-N-LOK Header SMD 4

MPN3-794638-4
Active

TE Connectivity AMP Connectors Micro MATE-N-LOK header, SMD, 4 circuits, 2 rows, 3.00mm pitch, gold mating finish, shrouded with locking ramp, solder retention, UL94 V-0, -40°C~105°C.

$3.3100Ref. price · indicative, final on quote
RoHSRoHS Compliant
SeriesMicro MATE-N-LOK
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

3-794638-4 key specifications
ParameterValue
SeriesMicro MATE-N-LOK
TypeMale Pin
MountingSurface Mount
Connector typeHeader
Fastening typeLocking Ramp
Voltage rating250V
Current ratingVaries by Wire Gauge
Operating temperature-40°C~105°C
Contact materialBrass
Insulation colorBlack
Insulation height0.364\" (9.25mm)
Insulation materialPolyamide (PA), Nylon

All specifications

3-794638-4 additional specifications
ParameterValue
Material flammability ratingUL94 V-0
StyleBoard to Cable/Wire
PackageTape & Reel (TR); Cut Tape (CT)
FeaturesSolder Retention
ShroudingShrouded - 4 Wall
TerminationSolder
ApplicationsGeneral Purpose
Contact shapeSquare
Rows2
Pitch0.118\" (3.00mm)
Positions4
Row spacing - mating0.118\" (3.00mm)
Contact finish - postTin
Contact finish - matingGold
Contact finish thickness - post100.0µin (2.54µm)
Contact finish thickness - mating30.0µin (0.76µm)

Product details

The 3-794638-4: This 4-position, 2-row header uses a 3.00mm pitch on both rows, setting the board footprint for the mating wire receptacle. The shrouded 4-wall housing guides the plug during blind mating and prevents contact damage from off-angle insertion. In a vibration-prone environment—like an industrial cabinet or automotive interior—this latch keeps the pair mated without relying on friction alone.

Surface Mount Assembly and Retention

Frequently asked questions

What is the mating connector for 3-794638-4?

This header mates with a Micro MATE-N-LOK receptacle housing (e.g., 3-794637-x series) that accepts crimp terminals.

What is the recommended PCB layout for 3-794638-4?

The footprint uses a 3.00mm pitch between positions and 3.00mm row spacing. The SMD pads should match the solder tail dimensions; the shrouded housing requires a keep-out zone around the 9.25mm insulation height for clearance above the board. Refer to the product drawing for exact pad geometry and stencil aperture.