The tin-plated post (118.1 µinch / 3.00 µm) ensures good solderability and a reliable joint in wave-solder processes.
How the unshrouded design affects your board layout
This gives the board layout engineer maximum flexibility: the header mates with standard IDC sockets, crimp receptacles, or even a second header in a mezzanine stack. The trade-off is that the pins are mechanically unprotected; the mating half must provide the alignment and strain relief.
Why this header stands apart from the peer alternatives
Compared to the shrouded 8-position 1376366-8 (0.087" pitch, tin mating finish), this 32-position unshrouded header offers a higher circuit count on a wider pitch with gold mating contacts — better suited for signal-level interconnect where corrosion resistance matters. The 4-1775099-7 (20-position, 0.165" pitch, tin finish) is a power header with a locking ramp; this AMPMODU Mod II part targets signal duty with push-pull mating. The 1318699-3 (12-position, 4-row, 0.165" pitch, gold mating) is a higher-density power header — different form factor and application.