Tin plating and contact construction for moderate-duty signal paths
Tin is a cost-effective choice for moderate-duty signal paths — the 78.7µin plating provides consistent contact resistance and good solderability.

TE Connectivity AMPMODU Mod II, 32-position unshrouded pin header, 2.54mm pitch, right-angle through-hole, tin-plated contacts, 5A rating, UL94 V-0, RoHS, active production.
| Parameter | Value |
|---|---|
| Series | AMPMODU Mod II |
| Type | Male Pin |
| Mounting | Through Hole, Right Angle |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 5A |
| Operating temperature | -65°C ~ 105°C |
| Contact material | Copper Alloy |
| Insulation color | Green |
| Insulation height | 0.120\" (3.05mm) |
| Insulation material | Polybutylene Terephthalate (PBT) |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 1 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 32 |
| Contact finish - post | Tin |
| Contact length - post | 0.126\" (3.20mm) |
| Contact finish - mating | Tin |
| Contact length - mating | 0.228\" (5.80mm) |
| Contact finish thickness - post | 78.7µin (2.00µm) |
| Contact finish thickness - mating | 78.7µin (2.00µm) |
Tin is a cost-effective choice for moderate-duty signal paths — the 78.7µin plating provides consistent contact resistance and good solderability.
Yes, the 3-826949-2 is listed for board-to-board or cable interconnect. The right-angle orientation and unshrouded design allow it to mate with a receptacle on another board or a cable assembly, provided the mating half has the same 2.54mm pitch and 32 positions.