144-position SODIMM socket for board-edge memory
The 144 contacts match the standard SODIMM pinout used in DDR2 and DDR3 memory modules — the connector style is explicitly SODIMM, not the full-size DIMM. Gold plating on the contacts (10.0 µinch) provides reliable electrical interface over repeated module insertions, typical for field-upgradeable memory slots. The housing includes a board guide and latches — the board guide aligns the module during insertion, and the latches lock the module in place against vibration and shock. The natural-colored housing is a standard visual identifier for this generation of TE SODIMM sockets.
SMT solder profile and reflow compatibility
Surface-mount termination on a 0.050" (1.27 mm) card thickness — the socket accepts the standard SODIMM PCB thickness. The right-angle orientation places the module parallel to the motherboard, keeping the z-height low. The socket is RoHS3 compliant and suitable for lead-free reflow processes; the gold finish on the contacts is compatible with SAC solder alloys.