Rated 3A per contact with a gold mating finish (15.0µin) over a copper alloy square pin. Gold on the mating face supports repeated mating cycles — the contact interface stays low-resistance through several hundred insertions, which matters for test fixtures or modular boards that get reconfigured. The through-hole solder tails are tin-lead plated (100.0µin), so the board assembly process uses standard wave solder.
Sourcing This Obsolete Part
This part is marked Obsolete by TE Connectivity. It is available through independent distribution channels — quantities are lot-specific and confirmed at RFQ.
Pin Configuration and Mating Fit
Insulation height above the board is 0.090" (2.29mm).