58-Pin Dual-Row Breakaway for Dense Board-to-Board Links
The 4-103324-0-29: All 58 positions are loaded, so the full row density is available for signal routing — no blank positions to work around.

TE Connectivity AMPMODU Mod II header, breakaway, 58 circuits, 2.54 mm pitch, dual-row, unshrouded, right-angle through-hole solder termination, tin-lead plating on both mating and post, UL94 V-0 black thermoplastic housing, rated 3 A per contact.
| Parameter | Value |
|---|---|
| Series | AMPMODU Mod II |
| Type | Male Pin |
| Mounting | Through Hole, Right Angle |
| Connector type | Header, Breakaway |
| Fastening type | Push-Pull |
| Current rating | 3A |
| Operating temperature | -65°C~105°C |
| Contact material | Copper Alloy |
| Insulation color | Black |
| Insulation height | 0.238\" (6.05mm) |
| Insulation material | Thermoplastic |
| Material flammability rating | UL94 V-0 |
| Parameter | Value |
|---|---|
| Style | Board to Board or Cable |
| Package | Bulk |
| Shrouding | Unshrouded |
| Termination | Solder |
| Contact shape | Square |
| Rows | 2 |
| Pitch | 0.100\" (2.54mm) |
| Positions | 58 |
| Row spacing - mating | 0.100\" (2.54mm) |
| Contact finish - post | Tin-Lead |
| Contact length - post | 0.110\" (2.79mm) |
| Contact finish - mating | Tin-Lead |
| Contact length - mating | 0.318\" (8.08mm) |
| Contact finish thickness - post | 100.0µin (2.54µm) |
| Contact finish thickness - mating | 100.0µin (2.54µm) |
The 4-103324-0-29: All 58 positions are loaded, so the full row density is available for signal routing — no blank positions to work around.
Yes, it is a right-angle through-hole header — the pins exit perpendicular to the board, suited for board-edge or parallel-to-PCB routing.
The mating pitch is 0.100" (2.54 mm), with the same row spacing. This is the standard 0.100" grid for breadboard and prototyping compatibility.