Dual-row DIP header with 0.6" row spacing
The 4-1571552-9: Mating and post contacts carry 20.0 µin (0.51 µm) gold plating over beryllium copper and copper respectively; the open-frame housing is rated UL94 V-0.

TE Connectivity AMP 800 Series DIP header, order code 4-1571552-9, 28 positions, dual row, 2.54 mm pitch, gold-plated mating contacts, through-hole, solder termination.
| Parameter | Value |
|---|---|
| Type | DIP, 0.6\" (15.24mm) Row Spacing |
| Series | 800 |
| Mounting | Through Hole |
| Operating temperature | -55°C ~ 105°C |
| Housing material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Contact material - post | Copper |
| Contact material - mating | Beryllium Copper |
| Material flammability rating | UL94 V-0 |
| Package | Tube |
| Features | Open Frame |
| Termination | Solder |
| Pitch - post | 0.100\" (2.54mm) |
| Parameter | Value |
|---|---|
| Pitch | 0.100\" (2.54mm) |
| Contact resistance | 10mOhm |
| Contact finish - post | Gold |
| Contact finish - mating | Gold |
| Termination post length | 0.125\" (3.18mm) |
| Contact finish thickness - post | 20.0µin (0.51µm) |
| Contact finish thickness - mating | 20.0µin (0.51µm) |
| Number of positions or pins | 28 (2 x 14) |
The 4-1571552-9: Mating and post contacts carry 20.0 µin (0.51 µm) gold plating over beryllium copper and copper respectively; the open-frame housing is rated UL94 V-0.
Lead time depends on surplus availability. Stock is confirmed per RFQ; no continuous production or scheduled last-time-buy is active.