The 4-1734506-8: This AMPMODU receptacle carries 50 circuits on a 0.079" (2.00 mm) dual-row pitch — the board footprint needs a 2.00 mm × 2.00 mm grid of through-holes, with the row-to-row spacing also at 0.079" (2.00 mm). The 0.177" (4.50 mm) insulation height sets the z-height budget above the PCB; the 0.102" (2.60 mm) solder tail length determines the board thickness the through-hole can accommodate. Gold plating at 10.0 µin (0.25 µm) on the mating face, with a tin post finish at 80.0 µin (2.03 µm) — the gold side handles the repeated mate/unmate cycles; the tin tail solders reliably into the plated through-hole.
Board-to-board mating and termination checklist
Through-hole solder termination: the 0.102" (2.60 mm) post length fits standard 1.6 mm PCBs with enough protrusion for a reliable solder fillet. Mates with any 2.00 mm pitch dual-row male header of matching position count — confirm the header pin length clears the 4.50 mm insulation height before committing the board stack.
Lifecycle and compliance at a glance
ROHS3 Compliant.