Board-to-board signal interconnect at 1.25 mm pitch
The 4-174639-4 is a 14-position, 2-row receptacle from the Fine Pitch series, designed for board-to-board stacking at a 1.25 mm mating pitch. It terminates via surface-mount solder, making it a pick-and-place candidate for medium-density signal routing.
Operating envelope and material choices
Tin-to-tin interfaces are cost-effective for moderate mating-cycle duty; expect several hundred cycles before fretting becomes a concern.
