Board-to-board stacking with 1.25 mm pitch
The 4-175630-4 is a 14-position, dual-row receptacle from the TE Fine Pitch series, designed for board-to-board stacking at a 0.049" (1.25 mm) mating pitch. Surface-mount termination and a push-pull fastening system suit automated assembly in compact, low-profile interconnects where the mated stack height is driven by the mating header.
Signal-level current and environmental limits
Each forked contact is rated 0.5 A at 50 V, with tin plating on both the mating surface and the solder tail — the 31.5 µin (0.80 µm) tin finish on the mating side supports moderate mating cycle counts in clean, indoor environments.