The 4-794681-4 is a 14-position, dual-row header from the Micro MATE-N-LOK series, pitched at 3.00 mm on both the row and column spacing.
This is the primary retention mechanism against cable pull and vibration.
Gold Mating Surface and UL94 V-0 Housing
The solder tails are tin-plated 100.0 µinch (2.54 µm) thick for reliable solder wetting.
