Board-to-Wire Header: 9 Positions, 2.50 mm Pitch
Termination Options: Press-Fit or Solder
Press-fit allows solderless assembly for high-reliability backplanes where rework is a concern; solder is available for standard through-hole processes.
Tin Plating: 80 µin for Reliable Contact
The mating contact finish is tin, 80.0 µin thick — a robust thickness that resists wear and corrosion over moderate mating cycles.
