Board-to-wire header, 4 positions, 2.00 mm pitch
Tin is cost-effective for moderate-cycle applications — expect a few hundred mating cycles before wear-through, adequate for field-service connections that are disconnected quarterly or less.
Termination and mounting: press-fit plus solder option
Termination is listed as press-fit and solder. The press-fit option suits backplane or high-reliability assemblies where solder reflow is avoided; the solder variant uses the same through-hole footprint.
If your BOM calls for more or fewer positions, these are direct drop-in candidates with the same footprint pitch.
Compliance and material approvals
ROHS3 compliant per TE's current material declaration.