The 2.00 mm pitch sets the board footprint and the per-contact current ceiling — at 3 A the temperature rise stays within the PA66 housing limit up to 85°C ambient.
Press-fit or solder — termination flexibility
Press-fit avoids reflow and is preferred for high-reliability backplane assembly where rework must be minimal; solder gives field-service flexibility. The contact length — 0.132" mating side, 0.134" post — fits standard 1.6 mm PCBs.
